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| Digital Electronics facility has a capability to develop and manufacture assemblies, sub-assemblies and equipment with literally any printed circuit board using Through-Hole, Surface Mount & Chip-On-Board Techniques. The products and assemblies manufactured from this facility have found use in industrial segments like Healthcare, Communication, Transportation and Industrial & Aerospace. The following are some of the facilities and machineries available in this facility: |
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- 9 SMT Assembly Lines
- Total Placement Capability 300,000cph
- Fine Pitch Placement up to 12 mil
- Component Ranges: 0201 To UBGA And BGA up to 55mm2
- 40 microns placement accuracy with 4σ capability
- RoHS compliant lines with N2 Environment
- Press fit connector insertion on any type of multilayer board using pneumatic press
- 1-24 Layer Board Assembly with board size : 508mm X 460 Mm
- Board Types: Rigid, Flex & Ceramic Substrates
- Placement Machines-Siemens, Fuji, Philips, Yamaha, Juki, Tenryu
- Screen Printers: DEK, MPM, HTI
- Reflow Machines: Vitronics , Heller, BTU
- Functional Test Development & Functional Testing.
- New AOI And X-Ray Equipme
- In-Circuit Tester
- Certified AS 9100, ISO 13485, ISO/TS 16949
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