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RF & Wireless manufacturing division has well over a decade of experience in manufacturing assemblies and sub-assemblies for industrial sectors such as medical, industrial, communications and consumer electronics. The following are the highlights of the facilities available in this division:
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- Class 10,000 clean room
- Die ejecting system
- Epoxy die bonders
- Automatic/semi-automatic wire bonders
- Glob top encapsulation
- Wire bonding capability (Cpk >2)
- Spectrum Analyzers
- Network Analyzers
- Sweep Oscillators
- RF Signal Generators
- Frequency Counters/ Universal Counter
- Noise Figure Meter / Noise Source
- Power Meters
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